ASIC/SoC/MCU Design Service

              ■Rich experiences for dozens of chips from design to successful tapeout

           ■Support mainstream processes from 0.5um to 14nm

           ■Familiar with Flatten flow and Hierachical design flow

           ■Successful case：Audio/Video SoC, X86 CPU，ARM-based MCU and etc

           ■Rich experiences with high reliability ESD (HBM 6KV, 8KV) design

           ■Rich experiences for high performance SoC/MCU design (frequency up to 1.8Ghz)

           ■Rich experiences for ultra-low power SoC/MCU design

Turnkey back-end service

(1)Fab&Process
           ■Rich experiences for processes from 0.35um to 14nm
           ■Cooperation with 16+ Foundries in worldwide
           ■Provide high quality IPs

(2)Tapeout Service
           ■MPW/Full Mask/MLM Tapeout
           ■Job desk view service
           ■Bussiness & technical support
(3)Quality service
           ■Pilot run
           ■Corner Split before mass production
           ■Risk run and mass production
           ■Yield control

Foundries : SMIC/CSMC/HHGRACE/DONGBU HITEK/UMC/GF/Silterra

Fast Packaging

Can provide professional packaging technology services and fast delivery, in order to achieve quality service and product quality.

(1)Package（Die to Package）

           ■The fastest delivery time is 7 days, supports mainstream packaging factories

           ■Package type:TO series、TSOT、DIP、SOP、QFP、TSSOP、QFN、DFN、BGA

(2)COB and ceramic rapid packaging

           ■High-end COB package --RFID and other types

           ■Ceramic-CDIP,CQFN,CQFP